What is FC-PGA?

 What is FC-PGA? Flip Chip Pin Grid Array Thermal Dissipation
Flip Chip Pin Grid Array

     FC-PGA was developed to improve the thermal dissipation of the heat generated by faster speed processors. The die has been flipped so that the heat is directed away from the desktop board. This feature, when combined with active heat sinks is an optimal cooling solution.

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 What is FC-PGA? Flip Chip Pin Grid Array Thermal Dissipation